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    There are many other names, including FR-4 light sheet, FR-4 fiber sheet, FR-4 epoxy sheet, FR-4 flame retardant sheet, so many names also reflect the wide application of FR-4 fiberglass sheet from other side. . FR-4 fiberglass sheet is generally used for soft-packing base layer, and then wrapped with fabric, leather, etc., to make beautiful wall and ceiling decoration. The application is very extensive. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and so on. The following is a detailed analysis of the performance characteristics of FR-4 glass fiberglass sheet: FR-4 epoxy fiberglass cloth, which is a kind of substrate with epoxy resin as binder and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad plate are important substrates for making multilayer printed circuit boards.
    性能:環氧玻纖布基板的機械性能、尺寸穩定性、抗沖擊性、耐濕性能比紙基板高。它的電氣性能優良,工作溫度較高,本身性能受環境影響小。在加工工藝上,要比其他樹脂的玻纖布基板具有很大的優越性。這類產品主要用于雙面PCB ,用量很大。電絕緣性能穩定、平整度好、表面光滑、無凹坑、厚度公差標準,適合應用于高性能電子絕緣要求的產品,如FPC補強板、PCB鉆孔墊板、玻纖介子、電位器碳膜印刷玻璃纖維板、精密游星齒輪(晶片研磨)、精密測試板材.氣(電器)設備絕緣撐條隔板、絕緣墊板、變壓器絕緣板、電機絕緣件、研磨齒輪、電子開關絕緣板等。
    Performance: The mechanical properties, dimensional stability, impact resistance and moisture resistance of the epoxy fiberglass substrate are higher than those of the paper substrate. Its electrical performance is excellent, its operating temperature is high, and its performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. These products are mainly used for double-sided PCBs and are used in large quantities. Stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance standards, suitable for high performance electronic insulation requirements, such as FPC reinforcement board, PCB drilling pad, glass fiber meson, potentiometer carbon Film printing fiberglass board, precision star gear (wafer grinding), precision test board, gas (electrical) equipment insulation struts, insulation pads, transformer insulation board, motor insulation parts, grinding gears, electronic switch insulation boards, etc.
    Surface preparation and treatment of FR-4 epoxy glass cloth laminate
    1. 銅面經過圖形和蝕刻形成電路之后,盡量要減少對PTFE表面的處理和接觸。操作員應配戴干凈手套并且在每片板子放隔層膠片以便傳遞到下一程序。
    1. After the copper surface is patterned and etched to form a circuit, try to reduce the handling and contact of the PTFE surface. The operator should wear clean gloves and place a film on each board for transfer to the next procedure.
    2. 經蝕刻過后的PTFE表面具備足夠粗糙度進行粘合。在蝕刻過薄片的地方或者未覆蓋層壓板將被粘合的地方,建議對PTFE表面進行處理以提供足夠的依附。在pth準備過程中所使用的化學成分也能用于表面處理。推薦等離子蝕刻或含鈉的化學試劑。
    2. The etched PTFE surface has sufficient roughness for bonding. Where the lamella is etched or where the laminate is not covered, it is recommended that the PTFE surface be treated to provide adequate attachment. The chemical components used in the pth preparation process can also be used for surface treatment. Plasma etching or sodium containing chemicals are recommended.
    3. 銅表面處理應保證最佳粘合強度。棕色的一氧化銅電路處理將加強表面形狀以便于使用TacBond粘合劑進行化學粘合。第一個過程要求一名清潔員去除殘余和處理用油。 接下來進行細微的銅蝕刻以形成一個統一的粗糙表面區域。棕色的氧化物針狀晶體在層壓過程中穩固了粘合層。同任何化學過程一樣,每一步進程后的充分清洗都是必需的。鹽殘余會抑制粘合。最后的沖洗應實行監督并保持PH值小于8.5。逐層干燥并確保表面不被手上的油之類的污染。
    3. Copper surface treatment should ensure optimum bond strength. The brown copper oxide circuit treatment will reinforce the surface shape for chemical bonding using TacBond adhesive. The first process requires a cleaner to remove residual and processing oil. A fine copper etch is then performed to form a uniform rough surface area. The brown oxide needle crystals stabilize the adhesive layer during lamination. As with any chemical process, adequate cleaning after each step is required. Salt residue will inhibit adhesion. The final rinse should be supervised and maintained at a pH of less than 8.5. Dry layer by layer and ensure that the surface is not contaminated by oil on your hands.
    Overlay and lamination
    Recommended bonding (press or plate) temperature: 425 ° F (220 ° C)
    1. 250oF(100℃)烘烤板層以消除水分。板層儲存在緊密控制的環境中并在24小時之內使用。
    1. Bake the plate at 250oF (100 ° C) to remove moisture. The plies are stored in a tightly controlled environment and used within 24 hours.
    2. 工具板與第一個電解板之間應使用壓力場以使得控制板中的壓力能平均分配。存在于板中以及將被填充的電路板中的高壓區域將被場吸收。場也能使從外部到中心的溫度統一起來。從而形成控制板與控制板之間的厚度統一。
    2. A pressure field should be used between the tool plate and the first plate to distribute the pressure in the control panel evenly. The high voltage regions present in the board and in the board to be filled will be absorbed by the field. The field also unifies the temperature from the outside to the center. Thereby forming a uniform thickness between the control board and the control board.
    3. 板必須由供應商提供的TAC BOND薄層組成。在切割薄層與疊加的時候要小心防止污染。根據電路設計及填充要求,1至3張粘合薄層是必需的。需要填充的區域以及介電要求都被用于計算0.0015"(38微米)薄板的需求。推薦在層壓板之間使用干凈精鋼制或鋁制鏡板。
    3. The board must consist of a thin layer of TAC BOND supplied by the supplier. Be careful to prevent contamination when cutting thin layers and stacking. Depending on the circuit design and filling requirements, 1 to 3 bonded layers are required. The areas that need to be filled and the dielectric requirements are used to calculate the 0.0015" (38 micron) sheet. It is recommended to use clean steel or aluminum mirror plates between the laminates.
    4. 為協助層壓,在加熱前進行20分鐘的真空處理。整個周期都保持真空狀態。抽離空氣將有助于確保完成電路的封裝。
    4. To assist in lamination, vacuum treatment is carried out for 20 minutes before heating. The vacuum is maintained throughout the cycle. Pumping away from the air will help ensure that the circuit is packaged.
    5. Place a thermocouple in the peripheral area of the center plate to determine temperature monitoring and appropriate cycles.
    6. 板可裝入冷的或已預熱的壓機壓盤上啟動。如果不用壓力場進行補償,熱力上升和循環將會不同。向包裝中輸入熱量并不是關鍵的,但應盡量控制以減少外圍與中心區域之間的差距。通常,熱率在12-20oF/min(6-9℃/min)到425oF(220℃)之間。
    6. The plate can be loaded onto a cold or preheated press platen. If the pressure field is not used for compensation, the heat rise and cycle will be different. It is not critical to enter heat into the package, but it should be controlled to minimize the gap between the perimeter and the center. Typically, the heat rate is between 12-20oF/min (6-9 °C/min) and 425oF (220 °C).
    7. 一旦裝入壓機中,壓力就能立即應用。壓力也將隨控制板的大小不同而不同。應控制在100-200psi(7-14bar)的范圍之內。
    7. Once loaded into the press, the pressure can be applied immediately. The pressure will also vary with the size of the control board. It should be controlled within the range of 100-200 psi (7-14 bar).
    8. 保持熱壓高溫在425oF(230℃)至少15分鐘。 溫度不得超過450oF(235℃).
    8. Maintain hot pressing at 425oF (230°C) for at least 15 minutes. The temperature must not exceed 450oF (235°C).
    9. 在層壓過程中,盡量減少無壓狀態的時間(如從熱壓機轉移到冷壓機的時間)。保持壓力狀態壓力直到低于200oF(100℃)。
    9. During the lamination process, minimize the time of no pressure (such as the time from the hot press to the cold press). Maintain pressure in the pressure state until it is below 200oF (100°C).